SEARAY
The SEARAY connector accommodates low-profile applications with stack heights of 7.00 to 15.00mm (.276 to .591") for the large and growing, high-density, high-performance mezzanine connector market.

Mini-Fit Products
Welcome to the world of Mini-Fit. The Mini-Fit family of high current/high density power connectors is designed to meet your specific requirements by offering the broadest range of configurations and options.

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HD Mezz
Designed for computer, networking, telecommunications, storage and general market applications with high pin-count devices on mezzanine or module printed circuit boards (PCBs).

SlimStack 0.40mm(.016") Pitch
SlimStack 0.4 is the newest and smallest pitch addition to the SlimStack micro SMT Board-to-Board connector family.

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SlimStack™ 0.50mm (.020") Pitch
Two-Piece 0.50 mm (.020") pitch SMT Board-to-Board connector system.

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SlimStack 0.635mm (.025") Pitch
0.635 mm (.025") pitch SMT Board-to-Board connector system comes in a variety of stack heights and circuit sizes.

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MDC Board-to-Board Connector
Molex offers the MDC connectors for mobile personal computer audio and modem codec solutions.

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Compression Connectors
Molex Compression Connectors -- New Solutions For Improved Design Flexibility and Space Savings

SlimStack 1.00mm (.039") Pitch
This versatile 1.00mm (.039") pitch board-to-board connector system comes in a variety of stack heights and circuit sizes.

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Plateau HS Mezz
Molex utilizes its proprietary Plateau Technology to create a high-speed, high-density surface-mounted mezzanine connector system.

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SCA-2
1.27 mm (.050") pitch. Complete solution for linking storage devices within the SCA-2 interconnection standards for 40-pin Fibre Channel and 80-pin SCSI.

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EBBI 50D
1.27 mm (.050") pitch leaf-style connectors carry all required signals, power and auxilliary signals within one interface for various mass storage applications.

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Plateau HS Dock™
Molex High Speed Docking Connectors Feature an Innovative Plated Plastic Housing for Outstanding Performance and Multiple Options for Application Design Flexibility

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Detachable Board-to-Board
Panel detachable board-to-board connectors. Available in two-piece and one-piece systems.

HDM
2.0 mm (.079") pitch. The 6-row High Density Metric (HDM) connector system is designed for applications that require high interconnect density and high-speed signal integrity.
HDM is a registered trademark of Teradyne, Inc.

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Milli-Grid™
2.00 mm (.079") pitch. Molexs Milli-Grid family of high density connectors is based on a 2.00 x 2.00mm grid pattern.

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VHDM
The 2.00 mm (.079") pitch Very High Density Metric (VHDM) connector system is available in 6 and 8 rows and versions and also include Right Angle Male, a Stacker System, and VHDM Lite versions.

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KK®
2.50 mm (.098") to 5.08 mm (.200") pitch Wire-to-Board, Board-to-Board interconnect systems.

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C-Grid® / SL Products
2.54 mm (.100") pitch grid interconnection products: C-Grid, the dual row, board-to-board system and SL™, the modular, single row wire-to- board and wire-to-wire system..

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Power Plus™ (SSI)
2.54 mm (.100") pitch grid. DPS/MPS power connectors meet Intels SSI (Server System Infrastructure) specifications.

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Micro-Fit, 3.0™
3.00 mm (.118") pitch signal/power connector capable of handling up to 5 amps/circuit. Available in through-hole and SMT.

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Battery Connectors
While many applications will require a custom designed battery connector, Molex is also able to offer various battery connectors as standard products.

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